Sn63Pb37 solder alloy is an eutectic SnPb alloy used widely in various soldering processes. This alloy provides excellent wettability with different substrates, ensuring high-quality solder joints. It is suitable for dip applications and can be used in all manual, automated and robotic processes, including those in the electronics industry where adherence to the RoHS2 directive is not required.
- Melting point: 183 °C
- Density: 8.42 g/cm³
- Yield strength: 44 MPa
- Tensile strength: 55 MPa
- Elongation: 30% (Fracture strain: 37%)
Sn60Pb40 alloy is used in various soldering processes. This alloy is primarily used for wave soldering as well as for dip applications and HASL (Hot Air Solder Leveling). It is suitable for all manual, automated and robotic processes, including applications in the electronics industry, where compliance with the RoHS2 directive is not required.
- Melting point: 183-191 °C
- Density: 8.53 g/cm³
- Yield strength: 44 MPa
- Tensile strength: 57 MPa
- Elongation: 40%
Over the past two decades, the electronics industry has experienced rapid growth due to the increasing use of electronic products in everyday life. Today, the SnPb36Ag2 alloy is widely used in the electronics industry because of its excellent electrical and thermal insulation properties, as well as its non-corrosive nature.