Sn42Bi58 alloy is one of the advanced soldering compounds with very low melting point. This alloy is widely used in the electronics industry and other fields due to its relatively low melting point, excellent wettability and lead-free characteristics. Additionally, it is highly effective for rework in electronic repairs due to its low melting point and suitable properties,. This alloy has high electrical resistance, and its flux residue is usually clear and colorless, contributing to the cleanliness of the final connections.
- Melting point: 138 °C
SnCu4 alloy is a high-performance lead-free solder alloy available in the industry. It can be used in dip soldering processes. SnCu4 is an effective solder alloy for minimizing copper dissolution.
- Melting point: 228-340 °C
- Density: 7.36 g/cm³
- Tensile strength: 45 MPa
The SnCu0.7 alloy is a high-performance lead-free solder alloy widely used in various industries due to its relatively lower cost in comparison with other lead-free solder alloys. It can be used in wave soldering, dip soldering and HASL (Hot Air Solder Leveling) applications.
- Melting point: 227 °C
- Density: 7.31 g/cm³
- Tensile strength: 39 MPa
- Elongation: 40%
SnAg3.5 alloy is a high-performance lead-free solder alloy available in the industry. It is used in wave soldering, dip soldering and HASL )Hot Air Solder Leveling( applications.
- Melting point: 221°C
- Density: 7.36 g/cm³
- Tensile strength: 54 MPa
The SnAg3Cu0.5 solder alloy has been designed and fabricated to improve fluidity and reduce spattering during dip and wave soldering processes. This alloy has also been developed for enhanced wettability and spreading.
- Melting point: 217-221 °C
- Density: 7.36 g/cm³
- Tensile strength: 49 MPa
- Elongation: 19%
The SnAg4Cu0.5In4 alloy is a high-performance lead-free solder alloy available in the industry. This alloy can serve as a replacement for tin-lead alloys in wave and dip soldering applications. It has superior mechanical properties and offers better reliability compared to conventional SnPb solders.
- Melting point: 205-210 °C
- Density: 7.40 g/cm³
- Tensile strength: 72 MP